ProductsHorizontal Machining CenterHP850

STM HMC Machine Optima HP850

STM HMC Machine Optima HP850

HP850

Travel (XxYxZ)(mm)

1000x900x1000

Pallet (LxW)(mm)

800x630

Spindle

BBT50 (HSK A100): 6000 rpm

Description

  • A dual contact BBT spindle ensures rigid tool support, improving surface quality and extending tool life.
  • A front low, rear high interface between the column and base reduces stress concentrations and enhances structural stability.
  • Three-point leveling with six pads provides consistent bed stability under heavy loads.
  • Advanced Finite Element Analysis (FEA) optimizes machine design by balancing weight and rigidity.
  • The operator-centric design incorporates user-friendly features for ease of use.

Specification

HP850UnitValues

Product Video

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Enquiry Form

+91
India